CYT3BBBCEBQ1BZEGST Infineon Technologies
Виробник: Infineon TechnologiesDescription: TRAVEO-2 BODY HIGH-END
Packaging: Tape & Reel (TR)
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 250MHz
Program Memory Size: 4.0625MB (4.0625M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
Data Converters: A/D 72x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 272-BGA (16x16)
Grade: Automotive
Number of I/O: 207
Qualification: AEC-Q100
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Технічний опис CYT3BBBCEBQ1BZEGST Infineon Technologies
Description: TRAVEO-2 BODY HIGH-END, Packaging: Tape & Reel (TR), Package / Case: 272-LFBGA, Mounting Type: Surface Mount, Speed: 100MHz, 250MHz, Program Memory Size: 4.0625MB (4.0625M x 8), RAM Size: 768K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, EEPROM Size: 256K x 8, Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F, Data Converters: A/D 72x12b SAR, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART, Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT, Supplier Device Package: 272-BGA (16x16), Grade: Automotive, Number of I/O: 207, Qualification: AEC-Q100.