Технічний опис CYT3DLABABQ1AESGS Infineon Technologies
Description: TRAVEO-2 CLUST.2.5DGRAPH, Number of I/O: 108, Supplier Device Package: 216-TEQFP (24x24), Peripherals: DMA, I2S, LVD, Temp Sensor, WDT, Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Core Size: 32-Bit Dual-Core, Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F, EEPROM Size: 128K x 8, Program Memory Type: FLASH, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 384K x 8, Program Memory Size: 4.0625MB (4.0625M x 8), Speed: 240MHz, Mounting Type: Surface Mount, Package / Case: 216-LQFP Exposed Pad, Packaging: Tray.
Інші пропозиції CYT3DLABABQ1AESGS
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
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CYT3DLABABQ1AESGS | Infineon Technologies |
 Description: TRAVEO-2 CLUST.2.5DGRAPHNumber of I/O: 108 Supplier Device Package: 216-TEQFP (24x24) Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Dual-Core Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F EEPROM Size: 128K x 8 Program Memory Type: FLASH Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 384K x 8 Program Memory Size: 4.0625MB (4.0625M x 8) Speed: 240MHz Mounting Type: Surface Mount Package / Case: 216-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 400 шт В кошику од. на суму грн. |
| CYT3DLABABQ1AESGS |
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Виробник: Infineon Technologies
Description: TRAVEO-2 CLUST.2.5DGRAPH
Number of I/O: 108
Supplier Device Package: 216-TEQFP (24x24)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Dual-Core
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 384K x 8
Program Memory Size: 4.0625MB (4.0625M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 216-LQFP Exposed Pad
Packaging: Tray
Description: TRAVEO-2 CLUST.2.5DGRAPH
Number of I/O: 108
Supplier Device Package: 216-TEQFP (24x24)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Dual-Core
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 384K x 8
Program Memory Size: 4.0625MB (4.0625M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 216-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 400 шт
В кошику
од. на суму грн.