D0808-42 Harwin Inc.
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 124 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
2+ | 155.99 грн |
10+ | 130.74 грн |
25+ | 125.18 грн |
50+ | 114.85 грн |
100+ | 109.63 грн |
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Технічний опис D0808-42 Harwin Inc.
Description: CONN IC DIP SOCKET 8POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Wire Wrap, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 196.9µin (5.00µm), Contact Material - Post: Brass, Part Status: Active.
Інші пропозиції D0808-42 за ціною від 66.12 грн до 168.51 грн
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||||||||||
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D0808-42 | Виробник : Harwin | IC & Component Sockets 8 WAY 3 LEVEL WIRE WRAP IC SKT |
на замовлення 2152 шт: термін постачання 21-30 дні (днів) |
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D0808-42 | Виробник : HARWIN |
Description: HARWIN - D0808-42 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, D08, 7.62 mm, Berylliumkupfer tariffCode: 85366930 productTraceability: No rohsCompliant: Y-EX Rastermaß: 2.54mm Anzahl der Kontakte: 8Contacts euEccn: NLR hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 SVHC: Lead (23-Jan-2024) |
на замовлення 3871 шт: термін постачання 21-31 дні (днів) |
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