D2608-42 Harwin Inc.
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Press-Fit
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 184.79 грн |
| 10+ | 155.01 грн |
| 25+ | 148.37 грн |
| 50+ | 136.15 грн |
| 100+ | 129.97 грн |
| 250+ | 117.59 грн |
| 500+ | 106.53 грн |
| 1000+ | 91.32 грн |
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Технічний опис D2608-42 Harwin Inc.
Description: CONN IC DIP SOCKET 8POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 196.9µin (5.00µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Press-Fit, Number of Positions or Pins (Grid): 8 (2 x 4), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Інші пропозиції D2608-42
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
|
D2608-42 | HARWIN |
Description: HARWIN - D2608-42 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, D26, 7.62 mm, BerylliumkupfertariffCode: 85366930 euEccn: NLR rohsCompliant: Y-EX Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 8Kontakt(e) SVHC: Lead (04-Feb-2026) Reihenabstand: 7.62mm Steckverbinder: DIP-Sockel Produktpalette: D26 productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
на замовлення 1674 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. |
| D2608-42 |
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Виробник: HARWIN
Description: HARWIN - D2608-42 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, D26, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: Y-EX
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 8Kontakt(e)
SVHC: Lead (04-Feb-2026)
Reihenabstand: 7.62mm
Steckverbinder: DIP-Sockel
Produktpalette: D26
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: HARWIN - D2608-42 - IC- & Baustein-Sockel, 8 Kontakt(e), DIP-Sockel, 2.54 mm, D26, 7.62 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: Y-EX
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 8Kontakt(e)
SVHC: Lead (04-Feb-2026)
Reihenabstand: 7.62mm
Steckverbinder: DIP-Sockel
Produktpalette: D26
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
на замовлення 1674 шт:
термін постачання 21-31 дні (днів)



