DA14535-00000FX2 Renesas Electronics Corporation
Виробник: Renesas Electronics Corporation
Description: IC RF TXRX+MCU BLE 24FCGQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN, FC
Mounting Type: Surface Mount
Memory Size: 12kB OTP, 160kB ROM, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.2V ~ 3.3V
Power - Output: 4dBm
Protocol: Bluetooth v5.3
Supplier Device Package: 24-FCGQFN (2.2x3)
GPIO: 12
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, JTAG, PWM, SPI, UART, USB
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Технічний опис DA14535-00000FX2 Renesas Electronics Corporation
Description: IC RF TXRX+MCU BLE 24FCGQFN, Packaging: Tape & Reel (TR), Package / Case: 24-WFQFN, FC, Mounting Type: Surface Mount, Memory Size: 12kB OTP, 160kB ROM, 64kB SRAM, Type: TxRx + MCU, Operating Temperature: -40°C ~ 105°C, Voltage - Supply: 1.2V ~ 3.3V, Power - Output: 4dBm, Protocol: Bluetooth v5.3, Supplier Device Package: 24-FCGQFN (2.2x3), GPIO: 12, RF Family/Standard: Bluetooth, Serial Interfaces: ADC, GPIO, I2C, JTAG, PWM, SPI, UART, USB.
Інші пропозиції DA14535-00000FX2 за ціною від 85.46 грн до 147.23 грн
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DA14535-00000FX2 | Renesas Electronics Corporation |
Description: IC RF TXRX+MCU BLE 24FCGQFN Packaging: Cut Tape (CT) Package / Case: 24-WFQFN, FC Mounting Type: Surface Mount Memory Size: 12kB OTP, 160kB ROM, 64kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.2V ~ 3.3V Power - Output: 4dBm Protocol: Bluetooth v5.3 Supplier Device Package: 24-FCGQFN (2.2x3) GPIO: 12 RF Family/Standard: Bluetooth Serial Interfaces: ADC, GPIO, I2C, JTAG, PWM, SPI, UART, USB |
на замовлення 5805 шт: термін постачання 21-31 дні (днів) |
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DA14535-00000FX2 | Renesas / Dialog |
RF System on a Chip - SoC Bluetooth Low Energy 5.3 SoC with integrated ARM Cortex-M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package |
на замовлення 2137 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. |
| DA14535-00000FX2 |
|
Виробник: Renesas Electronics Corporation
Description: IC RF TXRX+MCU BLE 24FCGQFN
Packaging: Cut Tape (CT)
Package / Case: 24-WFQFN, FC
Mounting Type: Surface Mount
Memory Size: 12kB OTP, 160kB ROM, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.2V ~ 3.3V
Power - Output: 4dBm
Protocol: Bluetooth v5.3
Supplier Device Package: 24-FCGQFN (2.2x3)
GPIO: 12
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, JTAG, PWM, SPI, UART, USB
Description: IC RF TXRX+MCU BLE 24FCGQFN
Packaging: Cut Tape (CT)
Package / Case: 24-WFQFN, FC
Mounting Type: Surface Mount
Memory Size: 12kB OTP, 160kB ROM, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.2V ~ 3.3V
Power - Output: 4dBm
Protocol: Bluetooth v5.3
Supplier Device Package: 24-FCGQFN (2.2x3)
GPIO: 12
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, JTAG, PWM, SPI, UART, USB
на замовлення 5805 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 147.23 грн |
| 10+ | 122.08 грн |
| 25+ | 115.27 грн |
| 100+ | 99.39 грн |
| 250+ | 94.12 грн |
| 500+ | 90.39 грн |
| 1000+ | 85.46 грн |
| DA14535-00000FX2 |
|
Виробник: Renesas / Dialog
RF System on a Chip - SoC Bluetooth Low Energy 5.3 SoC with integrated ARM Cortex-M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
RF System on a Chip - SoC Bluetooth Low Energy 5.3 SoC with integrated ARM Cortex-M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
на замовлення 2137 шт:
термін постачання 21-30 дні (днів)