DC2917-S Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: DISCRETE 2917 STAINLESS STEEL ST
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.244" (6.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 2
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Технічний опис DC2917-S Chip Quik Inc.
Description: DISCRETE 2917 TO 300MIL TH ADAPT, Packaging: Bulk, Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 2, Pitch: 0.244" (6.20mm), Board Thickness: 0.031" (0.79mm) 1/32", Proto Board Type: SMD to SIP, Package Accepted: 2917.
Інші пропозиції DC2917-S
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
DC2917S | Chip Quik Inc. |
Description: DISCRETE 2917 TO 300MIL TH ADAPT Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 2 Pitch: 0.244" (6.20mm) Board Thickness: 0.031" (0.79mm) 1/32" Proto Board Type: SMD to SIP Package Accepted: 2917 |
товару немає в наявності |
В кошику од. на суму грн. |
| DC2917S |
Виробник: Chip Quik Inc.
Description: DISCRETE 2917 TO 300MIL TH ADAPT
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.244" (6.20mm)
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: SMD to SIP
Package Accepted: 2917
Description: DISCRETE 2917 TO 300MIL TH ADAPT
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.244" (6.20mm)
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: SMD to SIP
Package Accepted: 2917
товару немає в наявності
В кошику
од. на суму грн.