DF30FB-30DS-0.4V(81) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 0.9mm
Contact Finish Thickness: 2.00µin (0.051µm)
Height Above Board: 0.035" (0.88mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 30
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Outer Shroud Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
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Технічний опис DF30FB-30DS-0.4V(81) Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 0.9mm, Contact Finish Thickness: 2.00µin (0.051µm), Height Above Board: 0.035" (0.88mm), Pitch: 0.016" (0.40mm), Number of Positions: 30, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Outer Shroud Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції DF30FB-30DS-0.4V(81)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| DF30FB-30DS-0.4V(81) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors RCPT 30POS 0.4MM SMT GOLD |
товару немає в наявності |