DF9-11P-1V(32) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN HDR 11POS SMD TIN
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 11
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Header, Center Strip Contacts
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
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Технічний опис DF9-11P-1V(32) Hirose Electric Co Ltd
Description: CONN HDR 11POS SMD TIN, Number of Rows: 2, Part Status: Active, Mated Stacking Heights: 4.3mm, Contact Finish Thickness: 39.4µin (1.00µm), Height Above Board: 0.130" (3.30mm), Pitch: 0.039" (1.00mm), Number of Positions: 11, Mounting Type: Surface Mount, Contact Finish: Tin, Connector Type: Header, Center Strip Contacts, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції DF9-11P-1V(32) за ціною від 43.85 грн до 79.04 грн
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DF9-11P-1V(32) | Hirose Electric Co Ltd |
Description: CONN HDR 11POS SMD TIN Number of Positions: 11 Mounting Type: Surface Mount Contact Finish: Tin Connector Type: Header, Center Strip Contacts Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) Number of Rows: 2 Part Status: Active Mated Stacking Heights: 4.3mm Contact Finish Thickness: 39.4µin (1.00µm) Height Above Board: 0.130" (3.30mm) Pitch: 0.039" (1.00mm) |
на замовлення 1189 шт: термін постачання 21-31 дні (днів) |
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DF9-11P-1V(32) | Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 11P TIN PLATING |
на замовлення 1614 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. |
| DF9-11P-1V(32) |
|
Виробник: Hirose Electric Co Ltd
Description: CONN HDR 11POS SMD TIN
Number of Positions: 11
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Header, Center Strip Contacts
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Description: CONN HDR 11POS SMD TIN
Number of Positions: 11
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Header, Center Strip Contacts
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
на замовлення 1189 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 79.04 грн |
| 10+ | 64.70 грн |
| 25+ | 62.02 грн |
| 50+ | 56.98 грн |
| 100+ | 54.49 грн |
| 250+ | 49.54 грн |
| 500+ | 43.85 грн |
| DF9-11P-1V(32) |
|
Виробник: Hirose Connector
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 11P TIN PLATING
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 11P TIN PLATING
на замовлення 1614 шт:
термін постачання 21-30 дні (днів)