DF9-11S-1V(32) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 11POS SMD TIN
Packaging: Tape & Reel (TR)
Features: Board Guide, Solder Retention
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 11
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
| Кількість | Ціна без ПДВ |
|---|---|
| 1000+ | 51.71 грн |
| 2000+ | 47.42 грн |
Відгуки про товар
Написати відгук
Технічний опис DF9-11S-1V(32) Hirose Electric Co Ltd
Description: CONN RCPT 11POS SMD TIN, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Connector Type: Receptacle, Outer Shroud Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 11, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Part Status: Active, Number of Rows: 2.
Інші пропозиції DF9-11S-1V(32) за ціною від 40.06 грн до 69.74 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
DF9-11S-1V(32) | Hirose Electric Co Ltd |
Description: CONN RCPT 11POS SMD TIN Packaging: Cut Tape (CT) Features: Board Guide, Solder Retention Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 11 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Part Status: Active Number of Rows: 2 |
на замовлення 2096 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
DF9-11S-1V(32) | Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 11P TIN PLATING |
на замовлення 1213 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. |
| DF9-11S-1V(32) |
|
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 11POS SMD TIN
Packaging: Cut Tape (CT)
Features: Board Guide, Solder Retention
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 11
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
Description: CONN RCPT 11POS SMD TIN
Packaging: Cut Tape (CT)
Features: Board Guide, Solder Retention
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 11
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
на замовлення 2096 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 69.74 грн |
| 10+ | 57.23 грн |
| 25+ | 53.61 грн |
| 50+ | 47.93 грн |
| 100+ | 45.62 грн |
| 250+ | 42.77 грн |
| 500+ | 40.06 грн |
| DF9-11S-1V(32) |
|
Виробник: Hirose Connector
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 11P TIN PLATING
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 11P TIN PLATING
на замовлення 1213 шт:
термін постачання 21-30 дні (днів)