DF9-19P-1V(32) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN HDR 19POS SMD TIN
Number of Rows: 2
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 19
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Header, Center Strip Contacts
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
| Кількість | Ціна без ПДВ |
|---|---|
| 1000+ | 55.96 грн |
| 2000+ | 51.31 грн |
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Технічний опис DF9-19P-1V(32) Hirose Electric Co Ltd
Description: CONN HDR 19POS SMD TIN, Number of Rows: 2, Mated Stacking Heights: 4.3mm, Contact Finish Thickness: 39.4µin (1.00µm), Height Above Board: 0.130" (3.30mm), Pitch: 0.039" (1.00mm), Number of Positions: 19, Mounting Type: Surface Mount, Contact Finish: Tin, Connector Type: Header, Center Strip Contacts, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції DF9-19P-1V(32) за ціною від 43.43 грн до 85.24 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||
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DF9-19P-1V(32) | Hirose Electric Co Ltd |
Description: CONN HDR 19POS SMD TINNumber of Rows: 2 Mated Stacking Heights: 4.3mm Contact Finish Thickness: 39.4µin (1.00µm) Height Above Board: 0.130" (3.30mm) Pitch: 0.039" (1.00mm) Number of Positions: 19 Mounting Type: Surface Mount Contact Finish: Tin Connector Type: Header, Center Strip Contacts Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) |
на замовлення 2010 шт: термін постачання 21-31 дні (днів) |
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DF9-19P-1V(32) | Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 19P TIN PLATING |
на замовлення 1520 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. |
| DF9-19P-1V(32) |
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Виробник: Hirose Electric Co Ltd
Description: CONN HDR 19POS SMD TIN
Number of Rows: 2
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 19
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Header, Center Strip Contacts
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
Description: CONN HDR 19POS SMD TIN
Number of Rows: 2
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 19
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Header, Center Strip Contacts
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
на замовлення 2010 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 85.24 грн |
| 10+ | 66.56 грн |
| 25+ | 61.37 грн |
| 50+ | 54.17 грн |
| 100+ | 50.93 грн |
| 250+ | 46.96 грн |
| 500+ | 43.43 грн |
| DF9-19P-1V(32) |
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Виробник: Hirose Connector
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 19P TIN PLATING
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 19P TIN PLATING
на замовлення 1520 шт:
термін постачання 21-30 дні (днів)



