Технічний опис DF9-23P-1V(32) Hirose Connector
Description: CONN HDR 23POS SMD TIN, Contact Finish Thickness: 39.4µin (1.00µm), Height Above Board: 0.130" (3.30mm), Pitch: 0.039" (1.00mm), Number of Positions: 23, Mounting Type: Surface Mount, Contact Finish: Tin, Connector Type: Header, Center Strip Contacts, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR), Number of Rows: 2, Mated Stacking Heights: 4.3mm.
Інші пропозиції DF9-23P-1V(32)
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
DF9-23P-1V(32) | Hirose Electric Co Ltd |
 Description: CONN HDR 23POS SMD TINContact Finish Thickness: 39.4µin (1.00µm) Height Above Board: 0.130" (3.30mm) Pitch: 0.039" (1.00mm) Number of Positions: 23 Mounting Type: Surface Mount Contact Finish: Tin Connector Type: Header, Center Strip Contacts Features: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Number of Rows: 2 Mated Stacking Heights: 4.3mm |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. |
| DF9-23P-1V(32) |
|
Виробник: Hirose Electric Co Ltd
Description: CONN HDR 23POS SMD TIN
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 23
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Header, Center Strip Contacts
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Number of Rows: 2
Mated Stacking Heights: 4.3mm
Description: CONN HDR 23POS SMD TIN
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 23
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Header, Center Strip Contacts
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Number of Rows: 2
Mated Stacking Heights: 4.3mm
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.