DF9-25P-1V(32) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN HDR 25POS SMD TIN
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 25
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Header, Center Strip Contacts
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Number of Rows: 2
| Кількість | Ціна без ПДВ |
|---|---|
| 1000+ | 62.21 грн |
| 2000+ | 57.05 грн |
Відгуки про товар
Написати відгук
Технічний опис DF9-25P-1V(32) Hirose Electric Co Ltd
Description: CONN HDR 25POS SMD TIN, Mated Stacking Heights: 4.3mm, Contact Finish Thickness: 39.4µin (1.00µm), Height Above Board: 0.130" (3.30mm), Pitch: 0.039" (1.00mm), Number of Positions: 25, Mounting Type: Surface Mount, Contact Finish: Tin, Connector Type: Header, Center Strip Contacts, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR), Number of Rows: 2.
Інші пропозиції DF9-25P-1V(32) за ціною від 53.63 грн до 93.76 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
DF9-25P-1V(32) | Hirose Electric Co Ltd |
Description: CONN HDR 25POS SMD TIN Number of Rows: 2 Mated Stacking Heights: 4.3mm Contact Finish Thickness: 39.4µin (1.00µm) Height Above Board: 0.130" (3.30mm) Pitch: 0.039" (1.00mm) Number of Positions: 25 Mounting Type: Surface Mount Contact Finish: Tin Connector Type: Header, Center Strip Contacts Features: Board Guide, Solder Retention Packaging: Cut Tape (CT) |
на замовлення 2506 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
 |
DF9-25P-1V(32) | Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 25P TIN PLATING |
на замовлення 1728 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. |
| DF9-25P-1V(32) |
|
Виробник: Hirose Electric Co Ltd
Description: CONN HDR 25POS SMD TIN
Number of Rows: 2
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 25
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Header, Center Strip Contacts
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
Description: CONN HDR 25POS SMD TIN
Number of Rows: 2
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 25
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Header, Center Strip Contacts
Features: Board Guide, Solder Retention
Packaging: Cut Tape (CT)
на замовлення 2506 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 93.76 грн |
| 10+ | 76.56 грн |
| 25+ | 71.81 грн |
| 50+ | 64.16 грн |
| 100+ | 61.09 грн |
| 250+ | 57.26 грн |
| 500+ | 53.63 грн |
| DF9-25P-1V(32) |
|
Виробник: Hirose Connector
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 25P TIN PLATING
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 25P TIN PLATING
на замовлення 1728 шт:
термін постачання 21-30 дні (днів)