DF9B-23P-1V(32) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN HDR 23POS SMD TIN
Number of Rows: 2
Mated Stacking Heights: 4.3mm
Contact Finish Thickness: 39.4µin (1.00µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 23
Mounting Type: Surface Mount
Contact Finish: Tin
Connector Type: Header, Center Strip Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
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Технічний опис DF9B-23P-1V(32) Hirose Electric Co Ltd
Description: CONN HDR 23POS SMD TIN, Number of Rows: 2, Mated Stacking Heights: 4.3mm, Contact Finish Thickness: 39.4µin (1.00µm), Height Above Board: 0.130" (3.30mm), Pitch: 0.039" (1.00mm), Number of Positions: 23, Mounting Type: Surface Mount, Contact Finish: Tin, Connector Type: Header, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Інші пропозиції DF9B-23P-1V(32)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
DF9B-23P-1V(32) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 23P TIN PLT MTL FIT |
товару немає в наявності |