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Технічний опис DILB14P-223TLF Amphenol FCI
Description: CONN IC DIP SOCKET 14POS TIN, Part Status: Active, Contact Material - Post: Copper Alloy, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA), Nylon, Termination: Solder, Number of Positions or Pins (Grid): 14 (2 x 7), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Інші пропозиції DILB14P-223TLF за ціною від 17.80 грн до 40.86 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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DILB14P-223TLF | Amphenol ICC (FCI) |
 Description: CONN IC DIP SOCKET 14POS TINPart Status: Active Contact Material - Post: Copper Alloy Contact Finish Thickness - Post: 100.0µin (2.54µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Copper Alloy Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA), Nylon Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
на замовлення 3721 шт: термін постачання 21-31 дні (днів) |
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DILB14P-223TLF | AMPHENOL COMMUNICATIONS SOLUTIONS |
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - DILB14P-223TLF - IC- & Baustein-Sockel, 14 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung tariffCode: 85366930 productTraceability: No Kontaktüberzug: Verzinnte Kontakte rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 14Kontakt(e) Steckverbinder: DIP-Sockel euEccn: NLR isCanonical: Y Kontaktmaterial: Kupferlegierung hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: - SVHC: No SVHC (17-Jan-2023) |
на замовлення 3145 шт: термін постачання 21-31 дні (днів) |
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| DILB14P-223TLF |
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Виробник: Amphenol ICC (FCI)
Description: CONN IC DIP SOCKET 14POS TIN
Part Status: Active
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 14POS TIN
Part Status: Active
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
на замовлення 3721 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 10+ | 34.81 грн |
| 11+ | 28.49 грн |
| 34+ | 26.15 грн |
| 68+ | 23.35 грн |
| 102+ | 22.70 грн |
| 272+ | 21.18 грн |
| 510+ | 19.92 грн |
| 1020+ | 18.97 грн |
| 2516+ | 17.80 грн |
| DILB14P-223TLF |
|
Виробник: AMPHENOL COMMUNICATIONS SOLUTIONS
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - DILB14P-223TLF - IC- & Baustein-Sockel, 14 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Verzinnte Kontakte
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 14Kontakt(e)
Steckverbinder: DIP-Sockel
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Kupferlegierung
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: -
SVHC: No SVHC (17-Jan-2023)
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - DILB14P-223TLF - IC- & Baustein-Sockel, 14 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Kupferlegierung
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Verzinnte Kontakte
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 14Kontakt(e)
Steckverbinder: DIP-Sockel
euEccn: NLR
isCanonical: Y
Kontaktmaterial: Kupferlegierung
hazardous: false
Reihenabstand: 7.62mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: -
SVHC: No SVHC (17-Jan-2023)
на замовлення 3145 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 21+ | 40.86 грн |
| 100+ | 34.05 грн |
| 250+ | 31.18 грн |
| 500+ | 23.01 грн |