DILB28P-223TLF AMPHENOL / PARTNER STOCK
Виробник: AMPHENOL / PARTNER STOCK
Description: AMPHENOL / PARTNER STOCK - DILB28P-223TLF - IC- & Baustein-Sockel, 28 Kontakt(e), DIP-Sockel, 2.54 mm, 15.24 mm, Kupferlegierung
tariffCode: 85366990
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Anzahl der Kontakte: 28Kontakt(e)
SVHC: To Be Advised
Reihenabstand: 15.24mm
Steckverbinder: DIP-Sockel
Produktpalette: -
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
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Технічний опис DILB28P-223TLF AMPHENOL / PARTNER STOCK
Description: CONN IC DIP SOCKET 28POS TIN, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyamide (PA), Nylon, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Material - Post: Copper Alloy, Part Status: Active.
Інші пропозиції DILB28P-223TLF за ціною від 35.02 грн до 71.95 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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DILB28P-223TLF | Amphenol ICC (FCI) |
Description: CONN IC DIP SOCKET 28POS TIN Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA), Nylon Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100.0µin (2.54µm) Contact Material - Post: Copper Alloy Part Status: Active |
на замовлення 12384 шт: термін постачання 21-31 дні (днів) |
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DILB28P-223TLF | Amphenol FCI |
IC & Component Sockets 28P DIP SOCKET STAMPED AND FORMED |
на замовлення 2117 шт: термін постачання 21-30 дні (днів) |
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DILB28P-223TLF | AMPHENOL COMMUNICATIONS SOLUTIONS |
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - DILB28P-223TLF - IC- & Baustein-Sockel, 28 Kontakt(e), DIP-Sockel, 2.54 mm, 15.24 mm, Kupferlegierung tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupferlegierung isCanonical: Y Anzahl der Kontakte: 28Kontakt(e) SVHC: No SVHC (17-Jan-2023) Reihenabstand: 15.24mm Steckverbinder: DIP-Sockel Produktpalette: - productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||||
| DILB28P-223TLF | AMPHENOL |
Category: Precision sockets Description: Socket: integrated circuits; Pitch: 2.54mm; open; THT; tinned Type of Socket: integrated circuits Flammability rating: UL94V-0 Operating temperature: -55...105°C Terminal pitch: 2.54mm Row pitch: 15.2mm Max. contact resistance:: 30mΩ Connector variant: open Contact material: copper alloy Body material: polyamide Electrical mounting: THT Contact plating: tinned |
на замовлення 12801 шт: термін постачання 14-30 дні (днів) |
|
| DILB28P-223TLF |
|
Виробник: Amphenol ICC (FCI)
Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA), Nylon
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Material - Post: Copper Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA), Nylon
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Material - Post: Copper Alloy
Part Status: Active
на замовлення 12384 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 5+ | 68.83 грн |
| 17+ | 54.14 грн |
| 34+ | 51.54 грн |
| 51+ | 46.99 грн |
| 102+ | 44.75 грн |
| 255+ | 41.94 грн |
| 510+ | 39.28 грн |
| 1003+ | 37.45 грн |
| 2516+ | 35.10 грн |
| DILB28P-223TLF |
|
Виробник: Amphenol FCI
IC & Component Sockets 28P DIP SOCKET STAMPED AND FORMED
IC & Component Sockets 28P DIP SOCKET STAMPED AND FORMED
на замовлення 2117 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 5+ | 71.95 грн |
| 10+ | 55.32 грн |
| 25+ | 44.02 грн |
| 100+ | 42.20 грн |
| 250+ | 38.96 грн |
| 500+ | 36.78 грн |
| 1000+ | 35.02 грн |
| DILB28P-223TLF |
|
Виробник: AMPHENOL COMMUNICATIONS SOLUTIONS
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - DILB28P-223TLF - IC- & Baustein-Sockel, 28 Kontakt(e), DIP-Sockel, 2.54 mm, 15.24 mm, Kupferlegierung
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Anzahl der Kontakte: 28Kontakt(e)
SVHC: No SVHC (17-Jan-2023)
Reihenabstand: 15.24mm
Steckverbinder: DIP-Sockel
Produktpalette: -
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: AMPHENOL COMMUNICATIONS SOLUTIONS - DILB28P-223TLF - IC- & Baustein-Sockel, 28 Kontakt(e), DIP-Sockel, 2.54 mm, 15.24 mm, Kupferlegierung
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Anzahl der Kontakte: 28Kontakt(e)
SVHC: No SVHC (17-Jan-2023)
Reihenabstand: 15.24mm
Steckverbinder: DIP-Sockel
Produktpalette: -
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| DILB28P-223TLF |
|
Виробник: AMPHENOL
Category: Precision sockets
Description: Socket: integrated circuits; Pitch: 2.54mm; open; THT; tinned
Type of Socket: integrated circuits
Flammability rating: UL94V-0
Operating temperature: -55...105°C
Terminal pitch: 2.54mm
Row pitch: 15.2mm
Max. contact resistance:: 30mΩ
Connector variant: open
Contact material: copper alloy
Body material: polyamide
Electrical mounting: THT
Contact plating: tinned
Category: Precision sockets
Description: Socket: integrated circuits; Pitch: 2.54mm; open; THT; tinned
Type of Socket: integrated circuits
Flammability rating: UL94V-0
Operating temperature: -55...105°C
Terminal pitch: 2.54mm
Row pitch: 15.2mm
Max. contact resistance:: 30mΩ
Connector variant: open
Contact material: copper alloy
Body material: polyamide
Electrical mounting: THT
Contact plating: tinned
на замовлення 12801 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 132+ | 52.15 грн |
| 700+ | 42.24 грн |
| 2800+ | 41.31 грн |
| 9180+ | 37.67 грн |