DILB42P-223TLF Amphenol Communications Solutions-FCI
Виробник: Amphenol Communications Solutions-FCIConn DIP Socket SKT 42 POS 2.54mm Solder ST Thru-Hole Tube
товару немає в наявності
Відгуки про товар
Написати відгук
Технічний опис DILB42P-223TLF Amphenol Communications Solutions-FCI
Description: CONN IC DIP SOCKET 42POS TINLEAD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 42 (2 x 21), Termination: Solder, Housing Material: Polyamide (PA), Nylon, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Material - Post: Copper Alloy.
Інші пропозиції DILB42P-223TLF
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| DILB42P-223TLF | Виробник : Amphenol ICC (FCI) |
Description: CONN IC DIP SOCKET 42POS TINLEAD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polyamide (PA), Nylon Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 100.0µin (2.54µm) Contact Material - Post: Copper Alloy |
товару немає в наявності |
||
 |
DILB42P-223TLF | Виробник : Amphenol FCI |
IC & Component Sockets DILB42P-223TLF-DILB ASSEMBLY |
товару немає в наявності |