DILB42P-223TLF Amphenol ICC (FCI)
Виробник: Amphenol ICC (FCI)
Description: CONN IC DIP SOCKET 42POS TINLEAD
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA), Nylon
Termination: Solder
Number of Positions or Pins (Grid): 42 (2 x 21)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
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Технічний опис DILB42P-223TLF Amphenol ICC (FCI)
Description: CONN IC DIP SOCKET 42POS TINLEAD, Contact Material - Post: Copper Alloy, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Finish - Mating: Tin-Lead, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA), Nylon, Termination: Solder, Number of Positions or Pins (Grid): 42 (2 x 21), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Інші пропозиції DILB42P-223TLF
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
|
DILB42P-223TLF | Amphenol FCI |
IC & Component Sockets DILB42P-223TLF-DILB ASSEMBLY |
товару немає в наявності |
В кошику од. на суму грн. |
| DILB42P-223TLF |
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Виробник: Amphenol FCI
IC & Component Sockets DILB42P-223TLF-DILB ASSEMBLY
IC & Component Sockets DILB42P-223TLF-DILB ASSEMBLY
товару немає в наявності
В кошику
од. на суму грн.


