DIP300-SOIC-14W Chip Quik
Виробник: Chip Quik
IC & Component Sockets DIP-14 (0.3" width, 0.1" pitch) to SOIC-14 Wide (1.27mm pitch, 300 mil body) Adapter
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Технічний опис DIP300-SOIC-14W Chip Quik
Description: DIP-14 (0.3" WIDTH, 0.1" PITCH), Packaging: Bulk, Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 14, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC.
Інші пропозиції DIP300-SOIC-14W
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
DIP300-SOIC-14W | Chip Quik Inc. |
Description: DIP-14 (0.3" WIDTH, 0.1" PITCH) Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
товару немає в наявності |
В кошику од. на суму грн. |
| DIP300-SOIC-14W |
|
Виробник: Chip Quik Inc.
Description: DIP-14 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-14 (0.3" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
товару немає в наявності
В кошику
од. на суму грн.