DSC6371HL3FB-024.0000T Microchip Technology
Виробник: Microchip Technology
Description: OSC MEMS SPREAD SPECTRUM SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: LVCMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Spread Spectrum Bandwidth: ±2.50%, Center Spread
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Part Status: Active
Frequency: 24 MHz
Base Resonator: MEMS
Description: OSC MEMS SPREAD SPECTRUM SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: LVCMOS
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Spread Spectrum Bandwidth: ±2.50%, Center Spread
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Part Status: Active
Frequency: 24 MHz
Base Resonator: MEMS
товару немає в наявності
Відгуки про товар
Написати відгук
Технічний опис DSC6371HL3FB-024.0000T Microchip Technology
Description: OSC MEMS SPREAD SPECTRUM SMD, Packaging: Tape & Reel (TR), Package / Case: 4-VFLGA, Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm), Mounting Type: Surface Mount, Output: LVCMOS, Type: XO (Standard), Operating Temperature: -40°C ~ 105°C, Frequency Stability: ±20ppm, Voltage - Supply: 1.71V ~ 3.63V, Spread Spectrum Bandwidth: ±2.50%, Center Spread, Current - Supply (Max): 3mA (Typ), Height - Seated (Max): 0.035" (0.89mm), Part Status: Active, Frequency: 24 MHz, Base Resonator: MEMS.
Інші пропозиції DSC6371HL3FB-024.0000T
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
---|---|---|---|---|---|
DSC6371HL3FB-024.0000T | Виробник : Microchip Technology |
![]() |
товару немає в наявності |