ED281DT On Shore Technology Inc.
Виробник: On Shore Technology Inc.Description: CONN IC DIP SOCKET 28POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 110°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Material - Post: Phosphor Bronze
на замовлення 5418 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 13+ | 25.37 грн |
| 17+ | 19.56 грн |
| 34+ | 18.63 грн |
| 51+ | 16.99 грн |
| 102+ | 16.17 грн |
| 255+ | 15.16 грн |
| 510+ | 14.20 грн |
| 1003+ | 13.54 грн |
| 2516+ | 12.69 грн |
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Технічний опис ED281DT On Shore Technology Inc.
Description: CONN IC DIP SOCKET 28POS TIN, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 110°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 60.0µin (1.52µm), Contact Material - Post: Phosphor Bronze.
Інші пропозиції ED281DT
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
ED281DT | Виробник : On-Shore Technology, Inc |
Conn DIP Socket SKT 28 POS Solder ST Thru-Hole |
товару немає в наявності |