ED32DT On-Shore Technology, Inc
| Кількість | Ціна без ПДВ |
|---|---|
| 33+ | 22.97 грн |
| 35+ | 21.53 грн |
| 38+ | 20.32 грн |
| 50+ | 18.79 грн |
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Технічний опис ED32DT On-Shore Technology, Inc
Description: CONN IC DIP SOCKET 32POS TIN, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 110°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 60.0µin (1.52µm), Contact Material - Post: Phosphor Bronze.
Інші пропозиції ED32DT за ціною від 13.53 грн до 24.74 грн
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ED32DT | On Shore Technology Inc. |
Description: CONN IC DIP SOCKET 32POS TINFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 110°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 60.0µin (1.52µm) Contact Material - Post: Phosphor Bronze |
на замовлення 1206 шт: термін постачання 21-31 дні (днів) |
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ED32DT | On-Shore Technology, Inc |
Conn DIP Socket SKT 32 POS Solder ST Thru-Hole |
на замовлення 68 шт: термін постачання 21-31 дні (днів) |
Мінімальне замовлення: 44 шт В кошику од. на суму грн. |
| ED32DT |
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Виробник: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 110°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 110°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Material - Post: Phosphor Bronze
на замовлення 1206 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 13+ | 24.74 грн |
| 16+ | 19.76 грн |
| 30+ | 18.79 грн |
| 60+ | 16.79 грн |
| 105+ | 16.13 грн |
| 255+ | 15.15 грн |
| 510+ | 14.19 грн |
| 1005+ | 13.53 грн |
| ED32DT |
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Виробник: On-Shore Technology, Inc
Conn DIP Socket SKT 32 POS Solder ST Thru-Hole
Conn DIP Socket SKT 32 POS Solder ST Thru-Hole
на замовлення 68 шт:
термін постачання 21-31 дні (днів)



