ESHF-115-01-F-D-TH-LC Samtec
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 280.71 грн |
| 57+ | 234.65 грн |
| 114+ | 201.11 грн |
| 513+ | 198.92 грн |
Товар під замовлення
Немає на нашому складі — привозимо зі складу постачальника після оформлення замовлення.
термін постачання:
31-40 дні (днів)
Мінімальна партія:
2 шт
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Технічний опис ESHF-115-01-F-D-TH-LC Samtec
Description: CONN HEADER VERT 30POS 1.27MM, Features: Board Lock, Keying Slot, Packaging: Tube, Connector Type: Header, Mounting Type: Through Hole, Number of Positions: 30, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Part Status: Active, Contact Shape: Square, Contact Length - Post: 0.075" (1.91mm), Insulation Height: 0.210" (5.33mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.120" (3.05mm).
Інші пропозиції ESHF-115-01-F-D-TH-LC
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| ESHF-115-01-F-D-TH-LC | Samtec Inc. |
 Description: CONN HEADER VERT 30POS 1.27MMFeatures: Board Lock, Keying Slot Packaging: Tube Connector Type: Header Mounting Type: Through Hole Number of Positions: 30 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Part Status: Active Contact Shape: Square Contact Length - Post: 0.075" (1.91mm) Insulation Height: 0.210" (5.33mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.120" (3.05mm) |
товару немає в наявності |
Мінімальне замовлення: 19 шт В кошику од. на суму грн. | |
 |
ESHF-115-01-F-D-TH-LC | SAMTEC |
Description: SAMTEC - ESHF-115-01-F-D-TH-LC - Stiftleiste, Wire-to-Board, 1.27 mm, 2 Reihe(n), 30 Kontakt(e), Durchsteckmontage, ESHF Kontaktüberzug: 0 Kontaktanschluss: 0 Rastermaß: 0 Anzahl der Kontakte: 0 Steckverbindersysteme: 0 Anzahl der Reihen: 0 Kontaktmaterial: 0 Steckverbinderkragen: 0 Produktpalette: ESHF SVHC: No SVHC (10-Jun-2022) |
товару немає в наявності |
В кошику од. на суму грн. |
| ESHF-115-01-F-D-TH-LC |
|
Виробник: Samtec Inc.
Description: CONN HEADER VERT 30POS 1.27MM
Features: Board Lock, Keying Slot
Packaging: Tube
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.075" (1.91mm)
Insulation Height: 0.210" (5.33mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
Description: CONN HEADER VERT 30POS 1.27MM
Features: Board Lock, Keying Slot
Packaging: Tube
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.075" (1.91mm)
Insulation Height: 0.210" (5.33mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
товару немає в наявності
Мінімальне замовлення: 19 шт
В кошику
од. на суму грн.
| ESHF-115-01-F-D-TH-LC |
|
Виробник: SAMTEC
Description: SAMTEC - ESHF-115-01-F-D-TH-LC - Stiftleiste, Wire-to-Board, 1.27 mm, 2 Reihe(n), 30 Kontakt(e), Durchsteckmontage, ESHF
Kontaktüberzug: 0
Kontaktanschluss: 0
Rastermaß: 0
Anzahl der Kontakte: 0
Steckverbindersysteme: 0
Anzahl der Reihen: 0
Kontaktmaterial: 0
Steckverbinderkragen: 0
Produktpalette: ESHF
SVHC: No SVHC (10-Jun-2022)
Description: SAMTEC - ESHF-115-01-F-D-TH-LC - Stiftleiste, Wire-to-Board, 1.27 mm, 2 Reihe(n), 30 Kontakt(e), Durchsteckmontage, ESHF
Kontaktüberzug: 0
Kontaktanschluss: 0
Rastermaß: 0
Anzahl der Kontakte: 0
Steckverbindersysteme: 0
Anzahl der Reihen: 0
Kontaktmaterial: 0
Steckverbinderkragen: 0
Produktpalette: ESHF
SVHC: No SVHC (10-Jun-2022)
товару немає в наявності
В кошику
од. на суму грн.