
ESHF-115-01-L-D-SM-LC Samtec
на замовлення 26 шт:
термін постачання 21-30 дні (днів)
Кількість | Ціна |
---|---|
1+ | 371.60 грн |
57+ | 321.56 грн |
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Технічний опис ESHF-115-01-L-D-SM-LC Samtec
Description: CONN HEADER SMD 30POS 1.27MM, Features: Board Lock, Keying Slot, Packaging: Tube, Connector Type: Header, Mounting Type: Surface Mount, Number of Positions: 30, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.215" (5.45mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.120" (3.05mm).
Інші пропозиції ESHF-115-01-L-D-SM-LC за ціною від 345.40 грн до 421.56 грн
Фото | Назва | Виробник | Інформація |
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ESHF-115-01-L-D-SM-LC | Виробник : Samtec Inc. |
![]() Features: Board Lock, Keying Slot Packaging: Tube Connector Type: Header Mounting Type: Surface Mount Number of Positions: 30 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.215" (5.45mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.120" (3.05mm) |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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