ESHF-115-01-L-D-SM-LC Samtec
| Кількість | Ціна |
|---|---|
| 1+ | 356.00 грн |
| 19+ | 350.12 грн |
| 57+ | 280.71 грн |
Відгуки про товар
Написати відгук
Технічний опис ESHF-115-01-L-D-SM-LC Samtec
Description: CONN HEADER SMD 30POS 1.27MM, Contact Length - Mating: 0.120" (3.05mm), Row Spacing - Mating: 0.050" (1.27mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.215" (5.45mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Cable/Wire, Number of Rows: 2, Number of Positions: 30, Mounting Type: Surface Mount, Connector Type: Header, Features: Board Lock, Keying Slot, Packaging: Tube.
Інші пропозиції ESHF-115-01-L-D-SM-LC за ціною від 318.77 грн до 389.64 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
||||
|---|---|---|---|---|---|---|---|---|---|
|
ESHF-115-01-L-D-SM-LC | Samtec Inc. |
Description: CONN HEADER SMD 30POS 1.27MMContact Length - Mating: 0.120" (3.05mm) Row Spacing - Mating: 0.050" (1.27mm) Insulation Material: Liquid Crystal Polymer (LCP) Shrouding: Shrouded - 4 Wall Insulation Height: 0.215" (5.45mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Insulation Color: Black Contact Material: Phosphor Bronze Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Operating Temperature: -55°C ~ 125°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 30 Mounting Type: Surface Mount Connector Type: Header Features: Board Lock, Keying Slot Packaging: Tube |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
|
| ESHF-115-01-L-D-SM-LC |
![]() |
Виробник: Samtec Inc.
Description: CONN HEADER SMD 30POS 1.27MM
Contact Length - Mating: 0.120" (3.05mm)
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.215" (5.45mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 30
Mounting Type: Surface Mount
Connector Type: Header
Features: Board Lock, Keying Slot
Packaging: Tube
Description: CONN HEADER SMD 30POS 1.27MM
Contact Length - Mating: 0.120" (3.05mm)
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.215" (5.45mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 30
Mounting Type: Surface Mount
Connector Type: Header
Features: Board Lock, Keying Slot
Packaging: Tube
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 389.64 грн |
| 10+ | 318.77 грн |




