Технічний опис ESQT-107-03-F-T-375 Samtec
Description: CONN SOCKET 21POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 21, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.083" (2.11mm), Insulation Height: 0.375" (9.53mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 3.
Інші пропозиції ESQT-107-03-F-T-375
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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ESQT-107-03-F-T-375 | Виробник : Samtec Inc. |
Description: CONN SOCKET 21POS 0.079 GOLD PCB Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 21 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.083" (2.11mm) Insulation Height: 0.375" (9.53mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 3 |
товару немає в наявності |