Технічний опис ESQT-110-02-F-D-635 Samtec
Description: CONN SOCKET 20POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 20, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.215" (5.46mm), Insulation Height: 0.635" (16.13mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Інші пропозиції ESQT-110-02-F-D-635
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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ESQT-110-02-F-D-635 | Виробник : Samtec |
 Conn Elevated Socket SKT 20 POS 2mm Solder ST Top Entry Thru-Hole Layer |
товару немає в наявності |
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| ESQT-110-02-F-D-635 | Виробник : Samtec Inc. |
Description: CONN SOCKET 20POS 0.079 GOLD PCB Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 20 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.215" (5.46mm) Insulation Height: 0.635" (16.13mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
товару немає в наявності |
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ESQT-110-02-F-D-635 | Виробник : Samtec |
Headers & Wire Housings 2.00 mm FleXYZ Flexible Elevated Socket Strip |
товару немає в наявності |