ESQT-110-03-F-T-375 Samtec Inc.

Description: CONN SOCKET 30POS 0.079 GOLD PCB, Number of Positions: 30, Mounting Type: Through Hole, Current Rating (Amps): 4.5A per Contact, Connector Type: Elevated Socket, Packaging: Bulk, Number of Rows: 3, Row Spacing - Mating: 0.079" (2.00mm), Insulation Height: 0.375" (9.53mm), Contact Length - Post: 0.083" (2.11mm), Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.079" (2.00mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Forked, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable.