
ESQT-125-02-S-D-550 Samtec
на замовлення 12 шт:
термін постачання 21-30 дні (днів)
Кількість | Ціна |
---|---|
1+ | 1007.46 грн |
11+ | 928.81 грн |
55+ | 663.98 грн |
110+ | 629.88 грн |
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Технічний опис ESQT-125-02-S-D-550 Samtec
Description: CONN SOCKET 50POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 50, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Contact Length - Post: 0.300" (7.62mm), Insulation Height: 0.550" (13.97mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Інші пропозиції ESQT-125-02-S-D-550
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
---|---|---|---|---|---|
ESQT-125-02-S-D-550 | Виробник : Samtec Inc. |
![]() Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 50 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Length - Post: 0.300" (7.62mm) Insulation Height: 0.550" (13.97mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
товару немає в наявності |