FSI-130-06-L-S-AD-WT-TR Samtec Inc.
Виробник: Samtec Inc.
Description: CONN STACKING 30POS SMD GOLD
Packaging: Tape & Reel (TR)
Features: Board Guide, Mating Guide, Solder Retention
Connector Type: Stacking Compression
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.039" (1.00mm)
Height Above Board: 0.236" (6.00mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 1
Description: CONN STACKING 30POS SMD GOLD
Packaging: Tape & Reel (TR)
Features: Board Guide, Mating Guide, Solder Retention
Connector Type: Stacking Compression
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.039" (1.00mm)
Height Above Board: 0.236" (6.00mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 1
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Технічний опис FSI-130-06-L-S-AD-WT-TR Samtec Inc.
Description: CONN STACKING 30POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Board Guide, Mating Guide, Solder Retention, Connector Type: Stacking Compression, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.039" (1.00mm), Height Above Board: 0.236" (6.00mm), Contact Finish Thickness: 10.0µin (0.25µm), Number of Rows: 1.
Інші пропозиції FSI-130-06-L-S-AD-WT-TR
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
FSI-130-06-L-S-AD-WT-TR | Виробник : Samtec |
 Board to Board & Mezzanine Connectors 1.00 mm One-Piece Interface |
товару немає в наявності |