Технічний опис FTM-114-03-F-DV-P Samtec
Description: CONN HEADER SMD 28POS 1MM, Features: Pick and Place, Packaging: Tube, Connector Type: Header, Cuttable, Current Rating (Amps): 2.8A per Contact, Mounting Type: Surface Mount, Number of Positions: 28, Number of Rows: 2, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.038" (0.97mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.039" (1.00mm), Contact Length - Mating: 0.065" (1.65mm).
Інші пропозиції FTM-114-03-F-DV-P
Фото | Назва | Виробник | Інформація |
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FTM-114-03-F-DV-P | Виробник : Samtec Inc. |
![]() Features: Pick and Place Packaging: Tube Connector Type: Header, Cuttable Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Number of Rows: 2 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.038" (0.97mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.039" (1.00mm) Contact Length - Mating: 0.065" (1.65mm) |
товару немає в наявності |
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FTM-114-03-F-DV-P | Виробник : Samtec |
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товару немає в наявності |