FTM-114-03-H-DV Samtec Inc.
Виробник: Samtec Inc.
Description: 1.00 MM SURFACE MOUNT MICRO LOW
Packaging: Tube
Contact Length - Mating: 0.065" (1.65mm)
Row Spacing - Mating: 0.039" (1.00mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Unshrouded
Insulation Height: 0.038" (0.97mm)
Contact Shape: Square
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.039" (1.00mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Rows: 2
Number of Positions: 28
Mounting Type: Surface Mount
Current Rating (Amps): 2.8A per Contact
Connector Type: Header, Cuttable
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Технічний опис FTM-114-03-H-DV Samtec Inc.
Description: 1.00 MM SURFACE MOUNT MICRO LOW, Packaging: Tube, Contact Length - Mating: 0.065" (1.65mm), Row Spacing - Mating: 0.039" (1.00mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Unshrouded, Insulation Height: 0.038" (0.97mm), Contact Shape: Square, Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.039" (1.00mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Rows: 2, Number of Positions: 28, Mounting Type: Surface Mount, Current Rating (Amps): 2.8A per Contact, Connector Type: Header, Cuttable.

