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Технічний опис FX26-20P-1SV Hirose Connector
Description: Interconnect Rectangular, Features: Board Guide, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Plug, Floating, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 20, Pitch: 0.039" (1.00mm), Height Above Board: 0.610" (15.50mm), Contact Finish Thickness: 3.94µin (0.100µm), Mated Stacking Heights: 20mm, Number of Rows: 2.
Інші пропозиції FX26-20P-1SV
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| FX26-20P-1SV | Hirose Electric Co Ltd |
 Description: Interconnect RectangularFeatures: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Plug, Floating Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.039" (1.00mm) Height Above Board: 0.610" (15.50mm) Contact Finish Thickness: 3.94µin (0.100µm) Mated Stacking Heights: 20mm Number of Rows: 2 |
товару немає в наявності |
Мінімальне замовлення: 250 шт В кошику од. на суму грн. |
| FX26-20P-1SV |
|
Виробник: Hirose Electric Co Ltd
Description: Interconnect Rectangular
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Plug, Floating
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.039" (1.00mm)
Height Above Board: 0.610" (15.50mm)
Contact Finish Thickness: 3.94µin (0.100µm)
Mated Stacking Heights: 20mm
Number of Rows: 2
Description: Interconnect Rectangular
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Plug, Floating
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.039" (1.00mm)
Height Above Board: 0.610" (15.50mm)
Contact Finish Thickness: 3.94µin (0.100µm)
Mated Stacking Heights: 20mm
Number of Rows: 2
товару немає в наявності
Мінімальне замовлення: 250 шт
В кошику
од. на суму грн.