HC5517BCB

HC5517BCB Harris Corporation


HRISD00046-4-61.pdf?t.download=true&u=5oefqw Виробник: Harris Corporation
Description: RINGING SLIC FOR ISDN MODEM
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: 2-Wire, 4-Wire, ISDN
Operating Temperature: 0°C ~ 75°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 6mA
Supplier Device Package: 28-SOIC
Part Status: Active
Number of Circuits: 1
Power (Watts): 300 mW
на замовлення 1040 шт:

термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
108+184.16 грн
Мінімальне замовлення: 108
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Технічний опис HC5517BCB Harris Corporation

Description: RINGING SLIC FOR ISDN MODEM, Packaging: Bulk, Package / Case: 28-SOIC (0.295", 7.50mm Width), Mounting Type: Surface Mount, Function: Subscriber Line Interface Concept (SLIC), Interface: 2-Wire, 4-Wire, ISDN, Operating Temperature: 0°C ~ 75°C, Voltage - Supply: 4.75V ~ 5.25V, Current - Supply: 6mA, Supplier Device Package: 28-SOIC, Part Status: Active, Number of Circuits: 1, Power (Watts): 300 mW.