HCI2012F-R10J TAI-TECH Advanced Electronics Co., Ltd.
Виробник: TAI-TECH Advanced Electronics Co., Ltd.Description: IND 100NH 0.9OHM 300MA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: 0805 (2012 Metric)
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Multilayer
Operating Temperature: -40°C ~ 85°C
DC Resistance (DCR): 900mOhm Max
Q @ Freq: 18 @ 100MHz
Frequency - Self Resonant: 800MHz
Material - Core: Ceramic
Inductance Frequency - Test: 100 MHz
Supplier Device Package: 0805
Height - Seated (Max): 0.041" (1.05mm)
Inductance: 100 nH
Current Rating (Amps): 300 mA
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Технічний опис HCI2012F-R10J TAI-TECH Advanced Electronics Co., Ltd.
Description: IND 100NH 0.9OHM 300MA, Packaging: Tape & Reel (TR), Tolerance: ±5%, Package / Case: 0805 (2012 Metric), Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Multilayer, Operating Temperature: -40°C ~ 85°C, DC Resistance (DCR): 900mOhm Max, Q @ Freq: 18 @ 100MHz, Frequency - Self Resonant: 800MHz, Material - Core: Ceramic, Inductance Frequency - Test: 100 MHz, Supplier Device Package: 0805, Height - Seated (Max): 0.041" (1.05mm), Inductance: 100 nH, Current Rating (Amps): 300 mA.
Інші пропозиції HCI2012F-R10J
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HCI2012F-R10J | Виробник : TAI-TECH Advanced Electronics Co., Ltd. |
Description: IND 100NH 0.9OHM 300MA Packaging: Cut Tape (CT) Tolerance: ±5% Package / Case: 0805 (2012 Metric) Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Mounting Type: Surface Mount Shielding: Unshielded Type: Multilayer Operating Temperature: -40°C ~ 85°C DC Resistance (DCR): 900mOhm Max Q @ Freq: 18 @ 100MHz Frequency - Self Resonant: 800MHz Material - Core: Ceramic Inductance Frequency - Test: 100 MHz Supplier Device Package: 0805 Height - Seated (Max): 0.041" (1.05mm) Inductance: 100 nH Current Rating (Amps): 300 mA |
товару немає в наявності |