HDAM-23-12.0-S-13-1-P Samtec Inc.
Виробник: Samtec Inc.Description: 2.00 MM X 1.20 MM HD MEZZ RUGGED
Packaging: Tray
Features: Board Guide, Pick and Place
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 299
Pitch: 0.047" (1.20mm)
Height Above Board: 0.683" (17.35mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 20mm, 30mm
Number of Rows: 13
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Технічний опис HDAM-23-12.0-S-13-1-P Samtec Inc.
Description: 2.00 MM X 1.20 MM HD MEZZ RUGGED, Packaging: Tray, Features: Board Guide, Pick and Place, Connector Type: High Density Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 299, Pitch: 0.047" (1.20mm), Height Above Board: 0.683" (17.35mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 20mm, 30mm, Number of Rows: 13.
Інші пропозиції HDAM-23-12.0-S-13-1-P
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
HDAM-23-12.0-S-13-1-P | Виробник : Samtec |
Board to Board & Mezzanine Connectors 2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal |
товару немає в наявності |