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Технічний опис HPF-03-02-T-S-K-TR Samtec
Description: .200 HI POWER SOCKET ASSEMBLY, Features: Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Mounting Type: Surface Mount, Number of Positions: 3, Style: Board to Board, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.200" (5.08mm), Contact Finish - Mating: Tin, Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.351" (8.92mm), Number of Rows: 1.
Інші пропозиції HPF-03-02-T-S-K-TR
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
HPF-03-02-T-S-K-TR | Samtec Inc. |
 Description: .200 HI POWER SOCKET ASSEMBLYFeatures: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Mounting Type: Surface Mount Number of Positions: 3 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.200" (5.08mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.351" (8.92mm) Number of Rows: 1 |
товару немає в наявності |
Мінімальне замовлення: 225 шт В кошику од. на суму грн. |
|
|
HPF-03-02-T-S-K-TR | Samtec Inc. |
Description: .200 HI POWER SOCKET ASSEMBLY Features: Pick and Place Packaging: Cut Tape (CT) Connector Type: Receptacle Mounting Type: Surface Mount Number of Positions: 3 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.200" (5.08mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.351" (8.92mm) Number of Rows: 1 |
товару немає в наявності |
В кошику од. на суму грн. |
 |
HPF-03-02-T-S-K-TR | SAMTEC |
Description: SAMTEC - HPF-03-02-T-S-K-TR - Printbuchse, Einspeiseklemme, Board-to-Board, 5.08 mm, 1 Reihe(n), 3 Kontakt(e), Oberflächenmontage Kontaktüberzug: Verzinnte Kontakte Rastermaß: 5.08 Anzahl der Kontakte: 3 Steckverbindersysteme: Board-to-Board Anzahl der Reihen: 1 Kontaktmaterial: Beryllium-Kupfer Steckverbindermontage: Oberflächenmontage Produktpalette: HPF SVHC: No SVHC (10-Jun-2022) |
товару немає в наявності |
В кошику од. на суму грн. |
| HPF-03-02-T-S-K-TR |
|
Виробник: Samtec Inc.
Description: .200 HI POWER SOCKET ASSEMBLY
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Mounting Type: Surface Mount
Number of Positions: 3
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.351" (8.92mm)
Number of Rows: 1
Description: .200 HI POWER SOCKET ASSEMBLY
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Mounting Type: Surface Mount
Number of Positions: 3
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.351" (8.92mm)
Number of Rows: 1
товару немає в наявності
Мінімальне замовлення: 225 шт
В кошику
од. на суму грн.
| HPF-03-02-T-S-K-TR |
|
Виробник: Samtec Inc.
Description: .200 HI POWER SOCKET ASSEMBLY
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Mounting Type: Surface Mount
Number of Positions: 3
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.351" (8.92mm)
Number of Rows: 1
Description: .200 HI POWER SOCKET ASSEMBLY
Features: Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Mounting Type: Surface Mount
Number of Positions: 3
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.351" (8.92mm)
Number of Rows: 1
товару немає в наявності
В кошику
од. на суму грн.
| HPF-03-02-T-S-K-TR |
|
Виробник: SAMTEC
Description: SAMTEC - HPF-03-02-T-S-K-TR - Printbuchse, Einspeiseklemme, Board-to-Board, 5.08 mm, 1 Reihe(n), 3 Kontakt(e), Oberflächenmontage
Kontaktüberzug: Verzinnte Kontakte
Rastermaß: 5.08
Anzahl der Kontakte: 3
Steckverbindersysteme: Board-to-Board
Anzahl der Reihen: 1
Kontaktmaterial: Beryllium-Kupfer
Steckverbindermontage: Oberflächenmontage
Produktpalette: HPF
SVHC: No SVHC (10-Jun-2022)
Description: SAMTEC - HPF-03-02-T-S-K-TR - Printbuchse, Einspeiseklemme, Board-to-Board, 5.08 mm, 1 Reihe(n), 3 Kontakt(e), Oberflächenmontage
Kontaktüberzug: Verzinnte Kontakte
Rastermaß: 5.08
Anzahl der Kontakte: 3
Steckverbindersysteme: Board-to-Board
Anzahl der Reihen: 1
Kontaktmaterial: Beryllium-Kupfer
Steckverbindermontage: Oberflächenmontage
Produktpalette: HPF
SVHC: No SVHC (10-Jun-2022)
товару немає в наявності
В кошику
од. на суму грн.