HSEC1-030-01-L-DV-WT-K-TR Samtec Inc.
Виробник: Samtec Inc.Description: 1.00 MM EDGE RATE HIGH-SPEED EDG
Packaging: Tape & Reel (TR)
Features: Pick and Place, Solder Retention
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.039" (1.00mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Phosphor Bronze
Number of Positions/Bay/Row: 30
Number of Rows: 2
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Технічний опис HSEC1-030-01-L-DV-WT-K-TR Samtec Inc.
Description: 1.00 MM EDGE RATE HIGH-SPEED EDG, Packaging: Tape & Reel (TR), Features: Pick and Place, Solder Retention, Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.039" (1.00mm), Operating Temperature: -55°C ~ 125°C, Read Out: Dual, Contact Type: Cantilever, Card Type: PCI Express™, Card Thickness: 0.062" (1.57mm), Termination: Solder, Contact Finish Thickness: 10.0µin (0.25µm), Contact Material: Phosphor Bronze, Number of Positions/Bay/Row: 30, Number of Rows: 2.
Інші пропозиції HSEC1-030-01-L-DV-WT-K-TR
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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HSEC1-030-01-L-DV-WT-K-TR | Виробник : Samtec |
Standard Card Edge Connectors 1.00 mm Edge Rate HighSpeed Edge Card Connector, Vertical |
товару немає в наявності |