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Технічний опис HSS-C2540-SMT-TR Same Sky
Description: HEAT SINK TO-263 COPPER, Packaging: Tape & Reel (TR), Material: Copper, Length: 0.763" (19.38mm), Shape: Rectangular, Fins, Type: Board Level, Width: 1.000" (25.40mm), Package Cooled: TO-263 (D²Pak), Power Dissipation @ Temperature Rise: 3.8W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 21.90°C/W, Fin Height: 0.450" (11.43mm), Material Finish: Tin, Part Status: Active.
Інші пропозиції HSS-C2540-SMT-TR
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
HSS-C2540-SMT-TR | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK TO-263 COPPERPackaging: Tape & Reel (TR) Material: Copper Length: 0.763" (19.38mm) Shape: Rectangular, Fins Type: Board Level Width: 1.000" (25.40mm) Package Cooled: TO-263 (D²Pak) Power Dissipation @ Temperature Rise: 3.8W @ 75°C Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM Thermal Resistance @ Natural: 21.90°C/W Fin Height: 0.450" (11.43mm) Material Finish: Tin Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 6300 шт В кошику од. на суму грн. |
|
|
HSS-C2540-SMT-TR | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK TO-263 COPPER Packaging: Cut Tape (CT) Material: Copper Length: 0.763" (19.38mm) Shape: Rectangular, Fins Type: Board Level Width: 1.000" (25.40mm) Package Cooled: TO-263 (D²Pak) Power Dissipation @ Temperature Rise: 3.8W @ 75°C Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM Thermal Resistance @ Natural: 21.90°C/W Fin Height: 0.450" (11.43mm) Material Finish: Tin Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| HSS-C2540-SMT-TR |
|
Виробник: Same Sky (Formerly CUI Devices)
Description: HEAT SINK TO-263 COPPER
Packaging: Tape & Reel (TR)
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Power Dissipation @ Temperature Rise: 3.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 21.90°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
Description: HEAT SINK TO-263 COPPER
Packaging: Tape & Reel (TR)
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Power Dissipation @ Temperature Rise: 3.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 21.90°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 6300 шт
В кошику
од. на суму грн.
| HSS-C2540-SMT-TR |
|
Виробник: Same Sky (Formerly CUI Devices)
Description: HEAT SINK TO-263 COPPER
Packaging: Cut Tape (CT)
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Power Dissipation @ Temperature Rise: 3.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 21.90°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
Description: HEAT SINK TO-263 COPPER
Packaging: Cut Tape (CT)
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Power Dissipation @ Temperature Rise: 3.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 21.90°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.