HTEC8-130-01-S-DV-A Samtec
| Кількість | Ціна |
|---|---|
| 1+ | 339.16 грн |
| 25+ | 302.97 грн |
| 50+ | 244.59 грн |
| 560+ | 226.42 грн |
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Технічний опис HTEC8-130-01-S-DV-A Samtec
Description: 0.80 MM RUGGED HIGH-SPEED EDGE C, Features: Board Guide, Packaging: Tray, Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.031" (0.80mm), Operating Temperature: -55°C ~ 125°C, Read Out: Dual, Contact Type: Cantilever, Card Type: PCI Express™, Card Thickness: 0.062" (1.57mm), Termination: Solder, Contact Finish Thickness: 30.0µin (0.76µm), Contact Material: Copper Alloy, Number of Positions/Bay/Row: 30, Number of Rows: 2.
Інші пропозиції HTEC8-130-01-S-DV-A
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| HTEC8-130-01-S-DV-A | Виробник : Samtec Inc. |
 Description: 0.80 MM RUGGED HIGH-SPEED EDGE CFeatures: Board Guide Packaging: Tray Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Copper Alloy Number of Positions/Bay/Row: 30 Number of Rows: 2 |
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