HTST-110-01-S-DV-P-TR Samtec Inc.
Виробник: Samtec Inc.Description: CONN HEADER SMD 20POS 2.54MM
Features: Keying Slot, Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Header
Current Rating (Amps): 3.4A per Contact
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.350" (8.89mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.250" (6.35mm)
на замовлення 300 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 150+ | 322.45 грн |
| 300+ | 292.01 грн |
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Технічний опис HTST-110-01-S-DV-P-TR Samtec Inc.
Description: CONN HEADER SMD 20POS 2.54MM, Features: Keying Slot, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Header, Current Rating (Amps): 3.4A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.350" (8.89mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.250" (6.35mm).
Інші пропозиції HTST-110-01-S-DV-P-TR за ціною від 272.94 грн до 502.95 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||||
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HTST-110-01-S-DV-P-TR | Виробник : SAMTEC |
Description: SAMTEC - HTST-110-01-S-DV-P-TR - Stiftleiste, Wire-to-Board, 2.54 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, gerade, HTST tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 20Kontakt(e) euEccn: NLR Steckverbindersysteme: Wire-to-Board Steckverbindertyp: PCB-Stiftleiste Produktpalette: HTST productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm SVHC: No SVHC (21-Jan-2025) |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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HTST-110-01-S-DV-P-TR | Виробник : Samtec |
Headers & Wire Housings .100" High-Temp Shrouded Terminal Strip, Cable Mate |
на замовлення 952 шт: термін постачання 21-30 дні (днів) |
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HTST-110-01-S-DV-P-TR | Виробник : Samtec Inc. |
Description: CONN HEADER SMD 20POS 2.54MM Features: Keying Slot, Pick and Place Packaging: Cut Tape (CT) Connector Type: Header Current Rating (Amps): 3.4A per Contact Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.350" (8.89mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.250" (6.35mm) |
на замовлення 416 шт: термін постачання 21-31 дні (днів) |
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