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HTST-113-01-SM-DV Samtec


htst-2854338.pdf
Виробник: Samtec
Headers & Wire Housings .100" High-Temp Shrouded Terminal Strip, Cable Mate
на замовлення 26 шт:
термін постачання 21-30 дні (днів)
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Технічний опис HTST-113-01-SM-DV Samtec

Description: CONN HEADER SMD 26POS 2.54MM, Contact Length - Mating: 0.250" (6.35mm), Row Spacing - Mating: 0.100" (2.54mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.350" (8.89mm), Contact Shape: Square, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Natural, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Cable/Wire, Number of Rows: 2, Number of Positions: 26, Mounting Type: Surface Mount, Current Rating (Amps): 3.4A per Contact, Connector Type: Header, Features: Keying Slot, Packaging: Tube.

Інші пропозиції HTST-113-01-SM-DV

Фото Назва Виробник Інформація Доступність Ціна
HTST-113-01-SM-DV HTST-113-01-SM-DV Samtec Inc. htst-1xx-01-xx-dv-xx-x-xx-mkt.pdf Description: CONN HEADER SMD 26POS 2.54MM
Contact Length - Mating: 0.250" (6.35mm)
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.350" (8.89mm)
Contact Shape: Square
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Natural
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 26
Mounting Type: Surface Mount
Current Rating (Amps): 3.4A per Contact
Connector Type: Header
Features: Keying Slot
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 14 шт
В кошику  од. на суму  грн.
HTST-113-01-SM-DV htst-1xx-01-xx-dv-xx-x-xx-mkt.pdf
Виробник: Samtec Inc.
Description: CONN HEADER SMD 26POS 2.54MM
Contact Length - Mating: 0.250" (6.35mm)
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.350" (8.89mm)
Contact Shape: Square
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Natural
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 26
Mounting Type: Surface Mount
Current Rating (Amps): 3.4A per Contact
Connector Type: Header
Features: Keying Slot
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 14 шт
В кошику  од. на суму  грн.