HTST-115-01-L-DV-P Samtec Inc.
Виробник: Samtec Inc.Description: CONN HEADER SMD 30POS 2.54MM
Features: Keying Slot, Pick and Place
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 3.4A per Contact
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.350" (8.89mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.250" (6.35mm)
на замовлення 67 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 12+ | 419.66 грн |
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Технічний опис HTST-115-01-L-DV-P Samtec Inc.
Description: CONN HEADER SMD 30POS 2.54MM, Features: Keying Slot, Pick and Place, Packaging: Bulk, Connector Type: Header, Current Rating (Amps): 3.4A per Contact, Mounting Type: Surface Mount, Number of Positions: 30, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.350" (8.89mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.250" (6.35mm).
Інші пропозиції HTST-115-01-L-DV-P
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