HW-05-08-F-D-287-100 Samtec
Виробник: Samtec
Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header
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Технічний опис HW-05-08-F-D-287-100 Samtec
Description: CONN HDR 10POS 0.1 STACK T/H, Packaging: Bulk, Color: Black, Mounting Type: Through Hole, Pitch: 0.100" (2.54mm), Row Spacing: 0.100" (2.54mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 3.00µin (0.076µm), Number of Rows: 2, Number of Positions: 10, Length - Overall Pin: 0.530" (13.462mm), Length - Post (Mating): 0.143" (3.632mm), Length - Stack Height: 0.287" (7.290mm), Length - Tail: 0.100" (2.540mm).
Інші пропозиції HW-05-08-F-D-287-100
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
HW-05-08-F-D-287-100 | Samtec Inc. |
Description: CONN HDR 10POS 0.1 STACK T/H Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 3.00µin (0.076µm) Number of Rows: 2 Number of Positions: 10 Length - Overall Pin: 0.530" (13.462mm) Length - Post (Mating): 0.143" (3.632mm) Length - Stack Height: 0.287" (7.290mm) Length - Tail: 0.100" (2.540mm) |
товару немає в наявності |
В кошику од. на суму грн. |
 |
HW-05-08-F-D-287-100 | SAMTEC |
Description: SAMTEC - HW-05-08-F-D-287-100 - Stapelbare Leiterplattensteckverbinder, HW, 10 Kontakt(e), Stiftleiste, 2.54 mm Kontaktüberzug: Vergoldete Kontakte Kontaktanschluss: Durchsteckmontage, gerade Rastermaß: 2.54 Anzahl der Kontakte: 10 Anzahl der Reihen: 2 Kontaktmaterial: Phosphorbronze Produktpalette: HW SVHC: No SVHC (19-Jan-2021) |
товару немає в наявності |
В кошику од. на суму грн. |
| HW-05-08-F-D-287-100 |
|
Виробник: Samtec Inc.
Description: CONN HDR 10POS 0.1 STACK T/H
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 3.00µin (0.076µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.530" (13.462mm)
Length - Post (Mating): 0.143" (3.632mm)
Length - Stack Height: 0.287" (7.290mm)
Length - Tail: 0.100" (2.540mm)
Description: CONN HDR 10POS 0.1 STACK T/H
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 3.00µin (0.076µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.530" (13.462mm)
Length - Post (Mating): 0.143" (3.632mm)
Length - Stack Height: 0.287" (7.290mm)
Length - Tail: 0.100" (2.540mm)
товару немає в наявності
В кошику
од. на суму грн.
| HW-05-08-F-D-287-100 |
|
Виробник: SAMTEC
Description: SAMTEC - HW-05-08-F-D-287-100 - Stapelbare Leiterplattensteckverbinder, HW, 10 Kontakt(e), Stiftleiste, 2.54 mm
Kontaktüberzug: Vergoldete Kontakte
Kontaktanschluss: Durchsteckmontage, gerade
Rastermaß: 2.54
Anzahl der Kontakte: 10
Anzahl der Reihen: 2
Kontaktmaterial: Phosphorbronze
Produktpalette: HW
SVHC: No SVHC (19-Jan-2021)
Description: SAMTEC - HW-05-08-F-D-287-100 - Stapelbare Leiterplattensteckverbinder, HW, 10 Kontakt(e), Stiftleiste, 2.54 mm
Kontaktüberzug: Vergoldete Kontakte
Kontaktanschluss: Durchsteckmontage, gerade
Rastermaß: 2.54
Anzahl der Kontakte: 10
Anzahl der Reihen: 2
Kontaktmaterial: Phosphorbronze
Produktpalette: HW
SVHC: No SVHC (19-Jan-2021)
товару немає в наявності
В кошику
од. на суму грн.