| Кількість | Ціна |
|---|---|
| 1+ | 710.36 грн |
| 10+ | 568.43 грн |
| 112+ | 420.42 грн |
| 256+ | 362.43 грн |
| 512+ | 343.79 грн |
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Технічний опис ICA-628-SGG Samtec
Description: CONN IC DIP SOCKET 28POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Інші пропозиції ICA-628-SGG за ціною від 606.85 грн до 743.24 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
 |
ICA-628-SGG | Samtec Inc. |
 Description: CONN IC DIP SOCKET 28POS GOLDPart Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
на замовлення 39 шт: термін постачання 21-31 дні (днів) |
|
| ICA-628-SGG |
|
Виробник: Samtec Inc.
Description: CONN IC DIP SOCKET 28POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 28POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
на замовлення 39 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 743.24 грн |
| 10+ | 644.21 грн |
| 25+ | 606.85 грн |