ICF-308-S-O-TR Samtec
| Кількість | Ціна |
|---|---|
| 2+ | 248.47 грн |
| 50+ | 199.95 грн |
| 100+ | 148.03 грн |
| 900+ | 131.28 грн |
| 1800+ | 127.78 грн |
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Технічний опис ICF-308-S-O-TR Samtec
Description: CONN IC DIP SOCKET 8POS TIN, Contact Material - Post: Beryllium Copper, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Liquid Crystal Polymer (LCP), Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Tape & Reel (TR).
Інші пропозиції ICF-308-S-O-TR за ціною від 165.06 грн до 252.95 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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ICF-308-S-O-TR | Samtec Inc. |
 Description: CONN IC DIP SOCKET 8POS TINContact Material - Post: Beryllium Copper Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Liquid Crystal Polymer (LCP) Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Surface Mount Features: Open Frame Packaging: Cut Tape (CT) |
на замовлення 298 шт: термін постачання 21-31 дні (днів) |
|
| ICF-308-S-O-TR |
|
Виробник: Samtec Inc.
Description: CONN IC DIP SOCKET 8POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Liquid Crystal Polymer (LCP)
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Cut Tape (CT)
Description: CONN IC DIP SOCKET 8POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Liquid Crystal Polymer (LCP)
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Cut Tape (CT)
на замовлення 298 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 252.95 грн |
| 10+ | 206.97 грн |
| 25+ | 193.99 грн |
| 50+ | 173.35 грн |
| 100+ | 165.06 грн |