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ICF-632-S-O-TR

ICF-632-S-O-TR Samtec

icf.pdf
Виробник: Samtec
IC & Component Sockets .100 Surface Mount Screw Machine DIP Socket
на замовлення 220 шт:
термін постачання 21-30 дні (днів)
КількістьЦіна
1+571.03 грн
10+539.05 грн
25+455.62 грн
50+447.34 грн
100+373.47 грн
275+371.40 грн
В кошику  од. на суму  грн.
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Технічний опис ICF-632-S-O-TR Samtec

Description: CONN IC DIP SOCKET 32POS TIN, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Liquid Crystal Polymer (LCP), Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Tape & Reel (TR).

Інші пропозиції ICF-632-S-O-TR

Фото Назва Виробник Інформація Доступність Ціна
ICF-632-S-O-TR ICF-632-S-O-TR Samtec Inc. icf-xxx-xxx-x-xx-mkt.pdf Description: CONN IC DIP SOCKET 32POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Liquid Crystal Polymer (LCP)
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tape & Reel (TR)
товару немає в наявності
 Мінімальне замовлення: 275 шт
В кошику  од. на суму  грн.
ICF-632-S-O-TR ICF-632-S-O-TR Samtec Inc. icf-xxx-xxx-x-xx-mkt.pdf Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
ICF-632-S-O-TR icf-xxx-xxx-x-xx-mkt.pdf
ICF-632-S-O-TR
Виробник: Samtec Inc.
Description: CONN IC DIP SOCKET 32POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Liquid Crystal Polymer (LCP)
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 275 шт
В кошику  од. на суму  грн.
ICF-632-S-O-TR icf-xxx-xxx-x-xx-mkt.pdf
ICF-632-S-O-TR
Виробник: Samtec Inc.
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.