ICO-316-SGT Samtec
| Кількість | Ціна |
|---|---|
| 2+ | 254.34 грн |
| 56+ | 204.61 грн |
| 112+ | 151.20 грн |
| 504+ | 139.24 грн |
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Технічний опис ICO-316-SGT Samtec
Description: CONN IC DIP SOCKET 16POS GOLD, Housing Material: Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 16 (2 x 8), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm).
Інші пропозиції ICO-316-SGT за ціною від 190.17 грн до 300.64 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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ICO-316-SGT | Samtec Inc. |
 Description: CONN IC DIP SOCKET 16POS GOLDHousing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) |
на замовлення 433 шт: термін постачання 21-31 дні (днів) |
|
| ICO-316-SGT |
|
Виробник: Samtec Inc.
Description: CONN IC DIP SOCKET 16POS GOLD
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Description: CONN IC DIP SOCKET 16POS GOLD
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
на замовлення 433 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 300.64 грн |
| 10+ | 262.84 грн |
| 25+ | 248.95 грн |
| 50+ | 228.19 грн |
| 100+ | 217.33 грн |
| 250+ | 190.17 грн |