ICS-318-T Adam Tech
Виробник: Adam Tech
Description: IC SOCKET, DIP, 18P 2.54MM PITCH
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
| Кількість | Ціна без ПДВ |
|---|---|
| 27+ | 12.01 грн |
| 32+ | 9.87 грн |
| 34+ | 9.25 грн |
| 52+ | 8.25 грн |
| 104+ | 7.85 грн |
| 260+ | 7.36 грн |
| 520+ | 6.89 грн |
| 1014+ | 6.57 грн |
| 2522+ | 6.16 грн |
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Технічний опис ICS-318-T Adam Tech
Description: IC SOCKET, DIP, 18P 2.54MM PITCH, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Phosphor Bronze.
