IM323S6GXKMA1 Infineon Technologies


IM323-S6G_IM323-S6G2_Ver2.0_12-1-22.pdf Виробник: Infineon Technologies
Description: CIPOS TINY
Packaging: Tube
Package / Case: 26-PowerDIP Module (1.043", 26.50mm)
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Current: 6 A
Voltage: 600 V
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Технічний опис IM323S6GXKMA1 Infineon Technologies

Description: CIPOS TINY, Packaging: Tube, Package / Case: 26-PowerDIP Module (1.043", 26.50mm), Mounting Type: Through Hole, Type: IGBT, Configuration: 3 Phase Inverter, Voltage - Isolation: 2000Vrms, Current: 6 A, Voltage: 600 V.