IPC0013-S Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: QFN-20 STENCIL
Number of Positions: 20
Thermal Center Pad: 0.135" L x 0.135" W (3.43mm x 3.43mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Type: QFN/LFCSP
Pitch: 0.031" (0.80mm)
Material: Stainless Steel
Packaging: Bulk
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Технічний опис IPC0013-S Chip Quik Inc.
Description: QFN-20 STENCIL, Number of Positions: 20, Thermal Center Pad: 0.135" L x 0.135" W (3.43mm x 3.43mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm), Type: QFN/LFCSP, Pitch: 0.031" (0.80mm), Material: Stainless Steel, Packaging: Bulk.
