IPC0049 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: POWERSOIC-20/PSOP-20/HSOP-20
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Part Status: Active
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Технічний опис IPC0049 Chip Quik Inc.
Description: POWERSOIC-20/PSOP-20/HSOP-20, Packaging: Bulk, Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm), Material: FR4 Epoxy Glass, Number of Positions: 20, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: PowerSOIC, PSOP, HSOP, Part Status: Active.
