Відгуки про товар
Написати відгук
Технічний опис IPC0050 Chip Quik
Description: POWERSOIC-10/PSOP-10/HSOP-10, Packaging: Bulk, Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 10, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: PowerSOIC, PSOP, HSOP.
Інші пропозиції IPC0050
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
IPC0050 | Chip Quik Inc. |
 Description: POWERSOIC-10/PSOP-10/HSOP-10Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PowerSOIC, PSOP, HSOP |
товару немає в наявності |
В кошику од. на суму грн. |
| IPC0050 |
|
Виробник: Chip Quik Inc.
Description: POWERSOIC-10/PSOP-10/HSOP-10
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Description: POWERSOIC-10/PSOP-10/HSOP-10
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
товару немає в наявності
В кошику
од. на суму грн.